Original Products | Secure Payment | Same day delivery in Bengaluru |Need Help/ Support Call Us : SALES@PCHUB.CO.IN , MOBILE / WHATSAPP: 9845325440
Blog
Home / Motherboards / GIGABYTE / GIGABYTE X570 AORUS XTREME (WI-FI)(rev. 1.1)

GIGABYTE X570 AORUS XTREME (WI-FI)(rev. 1.1)

75,000.00

SKU: X570 AORUS XTREME (Wi-Fi)(rev. 1.1) 

Categories: ,

Description

AMD X570 AORUS Motherboard with Direct 16 Phases Infineon Digital VRM, Fins-Array Heatsink, NanoCarbon Baseplate, Triple PCIe 4.0 M.2 with Thermal Guards, Intel® WiFi 6 802.11ax, ESS SABRE HiFi 9218, AQUANTIA® 10GbE LAN+1GbE LAN, RGB FAN COMMANDER, RGB Fusion 2.0
  • Supports AMD Ryzen™ 5000 Series / 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 3rd Gen Ryzen™ with Radeon™ Graphics/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ 1st Gen Ryzen™ with Radeon™ Vega Graphics Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Direct 16 Phases Infineon Digital VRM Solution with 70A Power Stage
  • Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
  • Onboard Intel® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
  • Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors
  • AQUANTIA® 10GbE BASE-T LAN + Intel® Gigabit LAN with cFosSpeed
  • Exclusive RGB FAN COMMANDER for Professional Casemoders
  • USB TurboCharger for Mobile Device Fast Charge Support
  • RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
  • Front & Rear USB 3.2 Gen 2 Type-C™ Headers
  • Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
EXTREME POWER DESIGN
THERMAL REACTIVE ARMOR
UNPARALLELED PERFORMANCE
NEXT GENERATION CONNECTIVITY
DEFINITIVE AESTHETICS
HI-FI AUDIO SYSTEM
ULTRA DURABLE
GIGABYTE BIOS & APP CENTER
DESIGN CONCEPT

Innovative design, cutting-edge function, state-of-art aesthetics, sophisticated thermal design, next generation network connection ,Hi-Fi level audio system. X570 AORUS XTREME is the new definition of flagship motherboard.


Direct 16 Phases Infineon Digital VRM

• 8 Layer PCIe 4.0 Ready Low Loss PCB
• 2X Copper PCB
Intel® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna

Intel® i211AT GbE LAN

• cFosSpeed Internet Accelerator
AQUANTIA 10GbE Base-T LAN

Thermal Reactive Armor

• Fins-Array
• Direct Touch Heatpipes
• 5 W/mK LAIRD Thermal Conductivity Pad
• NanoCarbon Baseplate
• 3x Enlarged M.2 Heatsink

Triple M.2 Connectors

• PCIe 4.0/3.0 x4
• Triple Thermal Guards

AMP-UP Audio

• ALC 1220-VB Audio Codec
• ESS 9218 SABRE DAC
• Audiophile Grade Capacitors
• Gold Plated Audio Jacks

RGB FUSION 2.0

• Addressable LED Header*2
• RGB LED Header*2
• RGB FAN COMMANDER

Supports AMD Ryzen™ Series Processors

• Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor

Solid Pin Power Connectors

• 24 pin ATX Power Connector
• 8+8 pin CPU Power Connector
• 6 pin PCIe Power Connector

DualBIOS™ with Socketed BIOS

• Q-Flash Plus
• DualBIOS Switch
Front USB 3.2 Gen2 Type-C™
PCIe 4.0 Turbo B-Clock IC

PCIe 4.0 x16/x8/x4 Slot

• 3x Ultra Durable PCIe Armor
USB TurboCharger
Thunderbolt™ Add-in Card Connector
GET READY FOR AMD RYZEN™ 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE’s dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

AMD StoreMI Technology

GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

The benefits of AMD StoreMI:

• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users’ computing behaviors

Extreme Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen™ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, X570 AORUS XTREME is a true beast among motherboards.
16 Direct Digital Power Design
Power Architecture
2X Copper PCB

THERMAL REACTIVE ARMOR
X570 AORUS XTREME uses some unprecedented and innovative thermal design to ensure CPU, Chipset, SSD stability and low temperature under full loading application and gaming.
Thermal Design
Right-Angled Connector
NanoCarbon Baseplate
Noise Detection
16X Hybrid Fan Header

Unparalleled Performance
Hungry for better performance? X570 AORUS XTREME has full PCIe 4.0 design, supports high frequency memory, and full SSD thermal guard to make sure you get the maximum full system performance.
XMP 5400+
PCIe 4.0 Design
3X M.2 PCIe 4.0 x4
3X M.2 Thermal Guards

Next Generation Connectivity
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570 AORUS XTREME provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
10 GbE Base-T LAN
WIFI 6 802.11ax
AORUS Antenna
USB TurboCharger

Definitive Aesthetics
GIGABYTE ID team designs X570 AORUS XTREME from the drawing board. After countless hours of conceptualizing ideas, fine tuning details and engaging in discussion, GIGABYTE has produced a board that is equal parts beast and beauty.
RGB FUSION 2.0
AORUS RGB FAN COMMANDER

HIFI AUDIO SYSTEM
Hi-Fi Audio System- As a Built-in Sound Card
For Hi-Fi Audio Solution, can be grouped into 2 parts.
Audio Signal Process, not distorted digital signal go through ESS 9218 Sabre DAC for Digital/Analog converter with 130dB SNR, 112dB THD+N and supports higher impedance up to 600 Ω headphone. Further, audiophile grade capacitor and gold plated audio jack ensures the non-compensated audio performance. Audio Signal Optimization, TXC Oscillator provides precise time triggers to Digital-Analog Converters. WIMA Capacitors to deliver crystal and balanced sound.

Audio Signal Process
Digital Audio
True Hi-Fidelity Music
Provides surround sound audio and enables DSD music playback
Digital / Analog Convert
ESS SABRE reference DAC 9218
  • Support QUAD DAC™
    to deliver superb 124dB DNR and -112dB THD+N.
  • True 2vrms outputs are capable of driving professional high impedance headphones and deliver professional line-level outputs.
  • Analog Volume Control
    delivers 130dB SNR at low listening levels by reducing noise as the audio signal decreases.
  • High-Res music
    Supports up to 32bit 192KHz PCM
Audio Signal Amplification
Audiophile Grade Capacitors
Deliver true acoustic sound
Crystal Sound Output
Gold Plated Audio Jacks
High resistance to corrosion and oxidation
Audio Signal Optimization
Precise TXC Oscillator
Provides precise time triggers to Digital-Analog Converters.
Audiophile Grade Capacitors
Famous WIMA capacitors are used as feedback signal processing to deliver crystal and balanced sound.
Ultra Durable
GIGABYTE is reputable for its durability and high quality manufacturing process. Needless to say, we use the best components we can find on the X570 AORUS XTREME and reinforce every slot to make each of them solid and durable.
3X PCIE Armor
4X Memory Armor
Solid Pin
Q-Flash Plus

GIGABYTE BIOS & APP CENTER
Good software goes hand in hand with perfect hardware. X570 AORUS XTREME bundled several useful and intuitive software to help users to control every aspect of motherboard.
BIOS
APP CENTER
Easy Tune
System Information Viewer

Additional information

CPU
AMD Socket AM4, Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 3rd Gen Ryzen™ with Radeon™ Graphics/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ 1st Gen Ryzen™ with Radeon™ Vega Graphics Processors
(Please refer “CPU Support List” for more information.)
Chipset
AMD X570
Memory
3rd Generation AMD Ryzen™ processors:
Support for DDR4 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.)/ 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
3rd Generation AMD Ryzen™ with Radeon™ Graphics processors:
Support for DDR4 5400(O.C.)/ 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.)/ 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
2nd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors / 1st Generation AMD Ryzen™ with Radeon™ Vega Graphics processors:
Support for DDR4 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(Please refer “Memory Support List” for more information.)
Audio
Realtek® ALC1220-VB codec
* The front panel line out jack supports DSD audio.
ESS SABRE9218 DAC chip
High Definition Audio
2/4/5.1/7.1-channel
Support for S/PDIF Out
LAN
1 x Aquantia GbE LAN chip (10 Gbit/5 Gbit/2.5 Gbit/1000 Mbit/100 Mbit) (LAN1)
1 x Intel® GbE LAN phy (10/100/1000 Mbit) (LAN2)
Wireless Communication module
Wi-Fi 802.11a/b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band
BLUETOOTH 5.0
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
* Actual data rate may vary depending on environment and equipment.
Expansion Slots
Integrated in the CPU (PCIEX16/PCIEX8):
3rd Generation AMD Ryzen™ processors:
1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x8 (PCIEX8)
2nd Generation AMD Ryzen™ processors/3rd Generation AMD Ryzen™ with Radeon™ Graphics processors:
1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX8)
* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
* The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When using the 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors and PCIEX8 slot is populated, the PCIEX16 slot operates at up to x8 mode.
2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/1st Generation AMD Ryzen™ with Radeon™ Vega Graphics processors:
1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)
Integrated in the Chipset (PCIEX4):
1 x PCI Express x16 slot, supporting PCIe 4.0*/3.0 and running at x4
* For 3rd Generation AMD Ryzen™ processors only.
Multi-Graphics Technology
Support for NVIDIA® Quad-GPU SLI™ and 2-Way NVIDIA® SLI™ technologies
Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies
* For 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors/3rd Generation AMD Ryzen™ with Radeon™ Graphics processors only.
Storage Interface
Integrated in the CPU (M2A_SOCKET):
3rd Generation AMD Ryzen™ processors:
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 x4/x2 SSD support)
2nd Generation AMD Ryzen™ processors/3rd Generation AMD Ryzen™ with Radeon™ Graphics processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/1st Generation AMD Ryzen™ with Radeon™ Vega Graphics processors:
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support)
Integrated in the Chipset (M2B_SOCKET/M2C_SOCKET):
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) (M2B_SOCKET)
* For 3rd Generation AMD Ryzen™ processors only.
1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) (M2C_SOCKET)
* For 3rd Generation AMD Ryzen™ processors only.
6 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, and RAID 10
* Refer to “1-9 Internal Connectors,” for the installation notices for the M.2 and SATA connectors.
USB
Integrated in the CPU:
2 x USB 3.2 Gen 2*/Gen 1 Type-A ports (red) on the back panel
* For 3rd Generation AMD Ryzen™ processors only.
2 x USB 3.2 Gen 1 ports on the back panel
Integrated in the Chipset:
1 x USB Type-C™ port with USB 3.2 Gen 2 support, available through the internal USB header
1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
3 x USB 3.2 Gen 2 Type-A port (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
Chipset+USB 3.2 Gen 1 Hub:
2 x USB 3.2 Gen 1 ports available through the internal USB header
2 x USB 2.0/1.1 ports available through the internal USB header
Chipset+USB 2.0 Hub:
4 x USB 2.0/1.1 ports on the back panel
Internal I/O Connectors
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
1 x OC PEG power connector
1 x CPU fan header
1 x water cooling CPU fan header
4 x system fan headers
2 x system fan/water cooling pump headers
2 x addressable LED strip headers
2 x RGB LED strip headers
3 x M.2 Socket 3 connectors
6 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB Type-C™ port, with USB 3.2 Gen 2 support
2 x USB 3.2 Gen 1 headers
1 x USB 2.0/1.1 header
1 x noise detection header
1 x Trusted Platform Module (TPM) header (2×6 pin, for the GC-TPM2.0_S module only)
1 x Thunderbolt™ add-in card connector
2 x temperature sensor headers
1 x power button
1 x reset button
2 x BIOS switches
Voltage Measurement Points
Back Panel Connectors
1 x Q-Flash Plus button
1 x Clear CMOS button
2 x SMA antenna connectors (2T2R)
1 x USB Type-C™ port, with USB 3.2 Gen 2 support
2 x USB 3.2 Gen 2*/Gen 1 Type-A ports (red)
* For 3rd Generation AMD Ryzen™ processors only.
3 x USB 3.2 Gen 2 Type-A ports (red)
2 x USB 3.2 Gen 1 ports
4 x USB 2.0/1.1 ports
2 x RJ-45 ports
1 x optical S/PDIF Out connector
5 x audio jacks
I/O Controller
iTE® I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Overheating warning
Fan fail warning
Fan speed control
* Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.
Noise detection
BIOS
2 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
Support for DualBIOS™
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for APP Center
* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
@BIOS
EasyTune
Fast Boot
Game Boost
RGB Fusion
Smart Backup
System Information Viewer
USB TurboCharger
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install
Bundled Software
Norton® Internet Security (OEM version)
cFosSpeed
XSplit Gamecaster + Broadcaster (12 months license)
Operating System
Support for Windows 10 64-bit
Form Factor
E-ATX Form Factor; 30.5cm x 27.0cm

Reviews

There are no reviews yet.

Be the first to review “GIGABYTE X570 AORUS XTREME (WI-FI)(rev. 1.1)”

Your email address will not be published. Required fields are marked *

X
X
Close Bitnami banner
Bitnami